SOPREMA U.S. Scholarship Program

High school seniors, graduates, and current undergraduate or graduate students pursuing architecture, engineering, construction management, or a similar building-envelope field at an accredited U.S. college or university may apply for the SOPREMA U.S. Scholarship Program.

Up to five non-renewable awards of $5,000 are offered nationwide. Submit a 1,000 to 1,500 word two-part essay, two instructor references, an unofficial transcript, and your expected graduation date by May 31.

SOPREMA supports the next generation of professionals in building envelope design and construction.